The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 28, 2021
Filed:
Nov. 22, 2018
Senju Metal Industry Co., Ltd., Tokyo, JP;
Senju Metal Industry Co., Ltd., Tokyo, JP;
Abstract
A flux which imparts thixotropy, and which exhibits excellent printability, printing sagging-inhibiting ability, and heating sagging-inhibiting ability; and a solder paste which uses said flux. This flux includes a thixotropic agent, a rosin, an organic acid, and a solvent. The thixotropic agent includes a cyclic amide compound obtained by polycondensing a dicarboxylic acid and/or a tricarboxylic acid, and a diamine and/or a triamine into a cyclic shape; and an acyclic amide compound which is obtained by polycondensing a monocarboxylic acid, a dicarboxylic acid and/or a tricarboxylic acid into an acyclic shape. The flux includes at least 0.1 wt % but not more than 8.0 wt % of the cyclic amide compound, and at least 0.5 wt % but not more than 8.0 wt % of the acyclic amide compound. The total amount of the cyclic amide compound and the acyclic amide compound is at least 1.5 wt % but not more than 10.0 wt %.