The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 21, 2021

Filed:

Mar. 23, 2020
Applicant:

Cisco Technology, Inc., San Jose, CA (US);

Inventors:

Vic Hong Chia, Sunnyvale, CA (US);

George Edward Curtis, San Jose, CA (US);

John David Stallings, Cedar Park, TX (US);

Assignee:

CISCO TECHNOLOGY, INC., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 9/00 (2006.01); H05K 5/02 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0015 (2013.01); H05K 1/0216 (2013.01); H05K 5/0217 (2013.01); H05K 5/0247 (2013.01); H05K 7/20172 (2013.01); H05K 2201/2036 (2013.01);
Abstract

A chassis-mounted electronic device includes a chassis, an upper EMI gasket, and a lower EMI gasket is provided. The chassis, including an upper chassis and a lower chassis, is constructed from a conductive sheet with a first thickness. The upper chassis and the lower chassis are coupled to form an interior of the chassis housing an electronic device. The upper EMI gasket is attached to the upper chassis, and is thinner than the upper chassis. The lower EMI gasket is attached to the lower chassis, and is also thinner than the lower chassis. The upper and lower EMI gaskets include perforations to allow cooling air through the EMI gaskets and into the interior of the chassis. Both the upper EMI gasket and the lower EMI gasket are configured to resiliently contact a portion of the electronic device to provide EMI shielding for the electronic device.


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