The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 21, 2021

Filed:

Mar. 29, 2020
Applicant:

Skyworks Solutions, Inc., Woburn, MA (US);

Inventors:

Howard E. Chen, Anaheim, CA (US);

Robert Francis Darveaux, Corona Del Mar, CA (US);

Assignee:

Skyworks Solutions, Inc., Irvine, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01); H05K 1/18 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/285 (2006.01); H01L 21/3205 (2006.01); H01L 21/683 (2006.01); H01L 21/768 (2006.01); H01L 21/78 (2006.01); H01L 25/03 (2006.01); H01L 23/31 (2006.01); H01L 25/10 (2006.01); H01L 25/16 (2006.01); H01L 25/18 (2006.01); H01L 23/48 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/2855 (2013.01); H01L 21/32051 (2013.01); H01L 21/4853 (2013.01); H01L 21/561 (2013.01); H01L 21/563 (2013.01); H01L 21/565 (2013.01); H01L 21/6836 (2013.01); H01L 21/76802 (2013.01); H01L 21/76877 (2013.01); H01L 21/78 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/66 (2013.01); H01L 24/49 (2013.01); H01L 24/73 (2013.01); H05K 1/181 (2013.01); H01L 23/3107 (2013.01); H01L 23/3128 (2013.01); H01L 23/481 (2013.01); H01L 23/49805 (2013.01); H01L 23/49811 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 24/81 (2013.01); H01L 24/97 (2013.01); H01L 25/03 (2013.01); H01L 25/105 (2013.01); H01L 25/16 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 2221/68327 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6616 (2013.01); H01L 2224/16141 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49052 (2013.01); H01L 2224/73257 (2013.01); H01L 2224/97 (2013.01); H01L 2225/107 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15321 (2013.01); H01L 2924/19106 (2013.01); H01L 2924/3025 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10734 (2013.01);
Abstract

A packaged radio-frequency device is disclosed, including a packaging substrate configured to receive one or more components, the packaging substrate including a first side and a second side. A shielded package may be implemented on the first side of the packaging substrate, the shielded package including a first circuit and a first overmold structure, the shielded package configured to provide radio-frequency shielding for at least a portion of the first circuit. A set of through-mold connections may be implemented on the second side of the packaging substrate, the set of through-mold connections defining a mounting volume on the second side of the packaging substrate. The device may include a component implemented within the mounting volume and a second overmold structure substantially encapsulating one or more of the component or the set of through-mold connections.


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