The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 21, 2021
Filed:
Jun. 30, 2017
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Sashi S. Kandanur, Chandler, AZ (US);
David Allen Unruh, Jr., Chandler, AZ (US);
Srinivas V. Pietambaram, Gilbert, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/532 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5329 (2013.01); H01L 21/481 (2013.01); H01L 21/4857 (2013.01);
Abstract
Semiconductor packages having nonspherical filler particles are described. In an embodiment, a semiconductor package includes a package substrate having a dielectric layer over an electrical interconnect. The dielectric layer includes nonspherical filler particles in a resin matrix. The nonspherical filler particles have an aspect ratio greater than one.