The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 21, 2021

Filed:

Dec. 04, 2019
Applicant:

Amkor Technology Singapore Holding Pte. Ltd., Singapore, SG;

Inventors:

Jin Suk Jeong, Incheon, KR;

Min Jae Kong, Seoul, KR;

Hyun Hye Jung, Incheon, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/552 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3128 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 23/552 (2013.01); H01L 25/00 (2013.01);
Abstract

In one example, a semiconductor device, comprising a substrate having a top side and a bottom side, an electronic device on the top side of the substrate, a first encapsulant on the top side of the substrate contacting a side of the electronic device, a second encapsulant on the bottom side of the substrate, wherein the second encapsulant includes an undercut at an end of the second encapsulant, and a cover layer comprising a top cover on a top side of the first encapsulant and a side cover on a side of the first encapsulant and a side of the substrate, wherein the side cover extends adjacent to the undercut. Other examples and related methods are also disclosed herein.


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