The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 21, 2021
Filed:
Apr. 25, 2018
Micron Technology, Inc., Boise, ID (US);
James D. Huffaker, Boise, ID (US);
Kim M. Hartnett, Boise, ID (US);
Ajay Raghunathan, Boise, ID (US);
Libo Wang, Boise, ID (US);
Linmiao Zhang, Singapore, SG;
Di Wu, Boise, ID (US);
Micron Technology, Inc., Boise, ID (US);
Abstract
Several embodiments of the present technology are directed to semiconductor devices, and systems and associated methods for treating semiconductor devices based on warpage data. In some embodiments, a method can include heating a plurality of semiconductor devices from a first temperature to a second temperature, and determining warpage data at a plurality of points on the surfaces of the semiconductor devices as they are being heated. The method can further comprise applying a multivariate analysis to the surface warpage data to generate a multivariate statistic for each of the semiconductor devices at various sample temperatures. The multivariate statistics can be used to determine whether the semiconductor devices exceed or fall below a threshold limit.