The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 21, 2021

Filed:

Jan. 24, 2018
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Douglas J. Resnick, Leander, TX (US);

Niyaz Khusnatdinov, Round Rock, TX (US);

Christopher Ellis Jones, Austin, TX (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/09 (2006.01); C03C 17/42 (2006.01); C03C 17/23 (2006.01); C03C 17/22 (2006.01);
U.S. Cl.
CPC ...
G03F 7/094 (2013.01); C03C 17/225 (2013.01); C03C 17/23 (2013.01); C03C 17/42 (2013.01); B32B 2250/03 (2013.01); B32B 2255/20 (2013.01); B32B 2307/724 (2013.01); B32B 2313/04 (2013.01); B32B 2315/08 (2013.01); B32B 2457/14 (2013.01); C03C 2218/152 (2013.01); C03C 2218/33 (2013.01);
Abstract

A superstrate can include a body having a surface; a buffer layer overlying the surface; and a protective layer overlying the buffer layer, wherein the protective layer has a surface roughness that is equal to or less than a surface roughness of the surface of the body. The protective layer can include a material that can be selectively removed with respect to the buffer layer, and the buffer layer can include a material that can be selectively removed with respect to the body of the superstrate. The superstrate can be used for more planarization or other processing sequences before the body needs to be replaced, as any defects that may form extend into the protective layer or buffer layer and not reach the body. The layers can be removed and replaced by corresponding new layers without significantly adversely affecting the body.


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