The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 21, 2021

Filed:

Nov. 12, 2019
Applicant:

Shanghai Huali Integrated Circuit Mfg. Co., Ltd., Shanghai, CN;

Inventors:

Lingye Yang, Shanghai, CN;

Li Sun, Shanghai, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/26 (2020.01); G01R 31/30 (2006.01); G06T 7/00 (2017.01);
U.S. Cl.
CPC ...
G01R 31/2644 (2013.01); G01R 31/2607 (2013.01); G01R 31/3004 (2013.01); G06T 7/001 (2013.01); G06T 2207/10061 (2013.01); G06T 2207/30148 (2013.01);
Abstract

A failure positioning method for positioning leakage defect cell between the gate and the active region of transistor cells arranged in an array. The positioning method includes the steps of: measuring the resistance between a first metal wire connecting the active regions and a second metal wire connecting the gates, and positioning a first region where the defect cell is located by resistance ratio; electrically isolating the active region contact holes and the gate contact holes from each other; shorting the gate contact holes in the first region; and performing active voltage contrast analysis on the plurality of columns of transistor cells in the first region to position the leakage defect in the first region by comparing the voltage contrast images. With the positioning method, the transistor cell having a leakage defect at nA level may be accurately found from a plurality of transistor cells arranged in an array. The positioning method helps to improve the yield of semiconductor device based on the above defect adjustment process.


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