The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 21, 2021

Filed:

Jul. 18, 2018
Applicant:

Fujimi Incorporated, Kiyosu, JP;

Inventor:

Makoto Tabata, Kiyosu, JP;

Assignee:

FUJIMI INCORPORATED, Kiyosu, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); C09G 1/00 (2006.01); B24B 1/00 (2006.01); C09G 1/06 (2006.01); C09K 3/14 (2006.01); C09K 13/06 (2006.01); C09G 1/04 (2006.01); H01L 21/321 (2006.01); H01L 21/306 (2006.01); B24B 37/04 (2012.01); H01L 21/304 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); B24B 1/00 (2013.01); B24B 37/044 (2013.01); C09G 1/00 (2013.01); C09G 1/04 (2013.01); C09G 1/06 (2013.01); C09K 3/1454 (2013.01); C09K 3/1463 (2013.01); C09K 13/06 (2013.01); H01L 21/30625 (2013.01); H01L 21/3212 (2013.01); H01L 21/304 (2013.01);
Abstract

A substrate polishing method includes a stock polishing step comprising a plurality of stock polishing sub-steps in which a first polishing solution, a second polishing solution, and a third polishing solution are applied, in that order, to a substrate. A content COMof water-soluble polymer Pin the first polishing solution, a content COMof water-soluble polymer Pin the second polishing solution, and a content COMof water-soluble polymer Pin the third polishing solution satisfy COM<COM<COM, and any one of the following conditions is satisfied: (1) average primary particle diameter Dof abrasive Ain the third polishing solution is smaller than average primary particle diameter Dof abrasive Ain the first polishing solution and average primary particle diameter Dof abrasive Ain the second polishing solution; and (2) the third polishing solution does not contain abrasive A.


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