The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 14, 2021

Filed:

Mar. 26, 2019
Applicant:

Shinko Electric Industries Co., Ltd., Nagano, JP;

Inventors:

Akira Takeuchi, Nagano, JP;

Hikaru Tanaka, Nagano, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/522 (2006.01); H01L 21/48 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 24/17 (2013.01); H01L 21/4853 (2013.01); H01L 21/76877 (2013.01); H01L 23/5226 (2013.01); H01L 2224/1703 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01);
Abstract

An interconnect substrate includes a substrate, and a first connection terminal and a second connection terminal that are disposed on a surface of the substrate, wherein the first connection terminal includes a first columnar electrode and a first bump disposed on the first columnar electrode, the first columnar electrode having a flat or convex surface and having a first diameter, wherein the second connection terminal includes a second columnar electrode and a second bump disposed on the second columnar electrode, the second columnar electrode having a concave surface and having a second diameter larger than the first diameter, and wherein a melting point of the first bump and the second bump is lower than a melting point of the first columnar electrode and the second columnar electrode.


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