The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 14, 2021

Filed:

Jul. 06, 2019
Applicant:

Amkor Technology Korea, Inc., Gwangju, KR;

Inventors:

Yeong Beom Ko, Taichung, TW;

Jo Hyun Bae, Incheon, KR;

Sung Woo Lim, Seoul, KR;

Yun Ah Kim, Incheon, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 23/528 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 24/09 (2013.01); H01L 21/56 (2013.01); H01L 23/3107 (2013.01); H01L 23/5283 (2013.01); H01L 2224/02371 (2013.01);
Abstract

In one example, a semiconductor device structure relates to an electronic device, which includes a device top surface, a device bottom surface opposite to the device top surface, device side surfaces extending between the device top surface and the device bottom surface, and pads disposed over the device top surface. Interconnects are connected to the pads, and the interconnects first regions that each extend from a respective pad in in an upward direction, and second regions each connected to a respective first region, wherein each second region extends from the respective first region in a lateral direction. The interconnects comprise a redistribution pattern on the pads. Other examples and related methods are also disclosed herein.


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