The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 14, 2021

Filed:

Aug. 21, 2019
Applicant:

Nanya Technology Corporation, New Taipei, TW;

Inventor:

Jung-Hsing Chien, Taoyuan, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/528 (2006.01); H01L 23/532 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 21/7682 (2013.01); H01L 21/76885 (2013.01); H01L 23/528 (2013.01); H01L 23/5226 (2013.01); H01L 23/5329 (2013.01);
Abstract

The present disclosure provides a semiconductor device and a method for preparing the semiconductor device. The method includes forming a first conductive layer over a substrate, forming a first dielectric structure over the first conductive layer, transforming a sidewall portion of the first conductive layer into a first transformed portion, removing the first transformed portion such that a width of the first dielectric structure is greater than a width of a remaining portion of the first conductive layer, and forming an inter-layer dielectric (ILD) layer covering sidewalls of the first dielectric structure such that a first air spacer is formed between the ILD layer and the remaining portion of the first conductive layer.


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