The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 14, 2021
Filed:
Jul. 01, 2019
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventors:
Chikara Kondo, Hachioji, JP;
Chiaki Dono, Chigasaki, JP;
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G11C 7/10 (2006.01); G11C 5/02 (2006.01); G11C 5/06 (2006.01); G11C 7/22 (2006.01); G06F 13/42 (2006.01);
U.S. Cl.
CPC ...
G11C 7/1006 (2013.01); G06F 13/4282 (2013.01); G11C 5/025 (2013.01); G11C 5/066 (2013.01); G11C 7/1066 (2013.01); G11C 7/1093 (2013.01); G11C 7/222 (2013.01); Y02D 10/00 (2018.01);
Abstract
Apparatuses and methods of data communication between semiconductor chips are described. An example apparatus includes: a first semiconductor chip and a second semiconductor chips that are stacked with each other via through substrate vias (TSVs) provided in one of the first semiconductor chip and the second semiconductor chip. The first semiconductor chip and the second semiconductor chips communicate with each other by use of data bus inversion data that have been encoded using a DBI algorithm.