The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 14, 2021
Filed:
Mar. 12, 2020
Samsung Electronics Co., Ltd., Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A memory device includes a first semiconductor chip including a memory cell array disposed on a first substrate, and a first bonding metal on a first uppermost metal layer of the first semiconductor chip, and a second semiconductor chip including circuit devices disposed on a second substrate and a second bonding metal on a second uppermost metal layer of the second semiconductor chip, the circuit devices providing a peripheral circuit operating the memory cell array. The first and second semiconductor chips are electrically connected to each other by the first bonding metal and the second bonding metal in a bonding area. A routing wire electrically connected to the peripheral circuit is disposed in one or both of the first and second uppermost metal layers and is disposed in a non-bonding area in which the first and second semiconductor chips are not electrically connected to each other.