The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 14, 2021
Filed:
Jun. 28, 2019
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Sumod Cherukkate, Bangalore, IN;
Gopinath K, Bangalore, IN;
Prakash Kurma Raju, Bangalore, IN;
Ajesh K K, Bangalore, IN;
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01); H05K 5/00 (2006.01); H05K 7/00 (2006.01); H05K 7/04 (2006.01); H04R 1/00 (2006.01); H04R 1/02 (2006.01); H04R 1/08 (2006.01); H04R 1/10 (2006.01); H04R 1/20 (2006.01); H04R 1/32 (2006.01); H04R 3/00 (2006.01); H04R 11/04 (2006.01); H04R 19/00 (2006.01); H04M 1/00 (2006.01); H04M 1/03 (2006.01); G06F 1/18 (2006.01); B81B 3/00 (2006.01); B81C 1/00 (2006.01); G06F 1/16 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
G06F 1/1605 (2013.01); H04R 1/08 (2013.01); H05K 1/111 (2013.01); H05K 1/189 (2013.01); H05K 7/04 (2013.01); H05K 2201/10083 (2013.01);
Abstract
Methods and apparatus to implement microphones in thin form factor electronic devices are disclosed. An electronic device includes a chassis having an exterior surface and an interior surface. The chassis includes a plurality of holes extending through the chassis. The plurality of holes are within a 1 mm diameter circular area of the chassis. The electronic device further includes a microphone coupled to the interior surface of the chassis adjacent the circular area of the chassis.