The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 07, 2021
Filed:
Nov. 20, 2019
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Huang-Kui Chen, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Abstract
In a method of manufacturing a semiconductor device, a first source/drain structure is formed over a substrate, one or more first insulating layers are formed over the first source/drain structure, a first opening is formed in the one or more first insulating layers, the first opening is filled with a first conductive material to form a first lower contact in contact with the first source/drain structure, one or more second insulating layers are formed over the first lower contact, a second opening is formed in the one or more second insulating layers to at least partially expose the first lower contact, a first liner layer is formed on at least a part of an inner side face of the second opening, and the second opening is filled with a second conductive material to form a first upper contact in contact with the first lower contact without the first liner layer.