The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 07, 2021

Filed:

Jun. 15, 2020
Applicant:

Showa Denko K.k., Tokyo, JP;

Inventors:

Takashi Aigo, Tokyo, JP;

Wataru Ito, Tokyo, JP;

Tatsuo Fujimoto, Tokyo, JP;

Assignee:

SHOWA DENKO K.K., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); C30B 25/16 (2006.01); C30B 29/36 (2006.01); H01L 21/205 (2006.01); C23C 16/32 (2006.01); C30B 25/18 (2006.01); C30B 25/20 (2006.01); C23C 16/02 (2006.01); C23C 16/455 (2006.01); C30B 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02378 (2013.01); C23C 16/029 (2013.01); C23C 16/325 (2013.01); C23C 16/45523 (2013.01); C30B 25/16 (2013.01); C30B 25/183 (2013.01); C30B 25/186 (2013.01); C30B 25/20 (2013.01); C30B 29/06 (2013.01); C30B 29/36 (2013.01); H01L 21/0262 (2013.01); H01L 21/02433 (2013.01); H01L 21/02529 (2013.01); H01L 21/02658 (2013.01); H01L 21/205 (2013.01);
Abstract

An epitaxial silicon carbide single crystal wafer having a small depth of shallow pits and having a high quality silicon carbide single crystal thin film and a method for producing the same are provided. The epitaxial silicon carbide single crystal wafer according to the present invention is produced by forming a buffer layer made of a silicon carbide epitaxial film having a thickness of 1 μm or more and 10 μm or less by adjusting the ratio of the number of carbon to that of silicon (C/Si ratio) contained in a silicon-based and carbon-based material gas to 0.5 or more and 1.0 or less, and then by forming a drift layer made of a silicon carbide epitaxial film at a growth rate of 15 μm or more and 100 μm or less per hour. According to the present invention, the depth of the shallow pits observed on the surface of the drift layer can be set at 30 nm or less.


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