The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 07, 2021
Filed:
Jul. 25, 2017
Applicant:
Anji Microelectronics Technology (Shanghai) Co., Ltd., Shangai, CN;
Inventors:
Wenting Zhou, Shanghai, CN;
Jianfen Jing, Shanghai, CN;
Assignee:
ANJI MICROELECTRONICS TECHNOLOGY (SHANGHAI) CO., LTD., Shanghai, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); C09K 13/00 (2006.01); C09K 13/02 (2006.01); H01L 21/3105 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); C09K 13/00 (2013.01); C09K 13/02 (2013.01); H01L 21/31053 (2013.01);
Abstract
A chemical-mechanical polishing slurry having high Silicon Nitride removal rate selectivity includes abrasive particles and a compound containing one or more carboxyl groups. The polishing slurry has high SiN removal rate, low TEOS removal rate, and high removal rate selectivity of SiN to TEOS. The polishing slurry can significantly reduce the defects on Oxide surface which has an excellent market application prospect.