The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 07, 2021

Filed:

Jan. 07, 2019
Applicant:

Aac Acoustic Technologies (Shenzhen) Co., Ltd., Shenzhen, CN;

Inventors:

Lieng Loo, Shenzhen, CN;

Shaoquan Wang, Shenzhen, CN;

Xiaohui Zhong, Shenzhen, CN;

Kahkeen Lai, Shenzhen, CN;

Kianheng Goh, Shenzhen, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); B81C 1/00 (2006.01); B81B 7/02 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00095 (2013.01); B81B 7/02 (2013.01); B81C 1/00055 (2013.01); B81C 1/00531 (2013.01); B81B 2201/02 (2013.01); B81C 2201/0132 (2013.01);
Abstract

The present disclosure provides a method for processing a conductive structure. The method includes the following steps of: forming on a first surface a groove concave from the first surface towards a second surface by means of dry etching; extending the groove from the second surface to form a via through a silicon base; and processing a conductive structure within the via. The method can be applied to a silicon base having a thickness larger than 300 μm. It breaks the limit on thickness that can be processed in the related art and is capable of providing electrical connectivity on both sides of a silicon base. The method is simple and highly reliable, has high processing efficiency and is applicable to mechanized production.


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