The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 31, 2021

Filed:

Jan. 07, 2020
Applicant:

Nxp Usa, Inc., Austin, TX (US);

Inventors:

Elie A. Maalouf, Mesa, AZ (US);

Margaret A. Szymanowski, Chandler, AZ (US);

Assignee:

NXP USA, Inc., Austin, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03F 1/02 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H03F 3/60 (2006.01); H03F 3/189 (2006.01); H03F 3/24 (2006.01); H03F 3/193 (2006.01); H03F 3/21 (2006.01); H03F 3/213 (2006.01);
U.S. Cl.
CPC ...
H03F 1/0288 (2013.01); H01L 23/49838 (2013.01); H01L 23/66 (2013.01); H01L 24/49 (2013.01); H01L 25/0655 (2013.01); H01L 25/50 (2013.01); H03F 3/189 (2013.01); H03F 3/193 (2013.01); H03F 3/211 (2013.01); H03F 3/213 (2013.01); H03F 3/24 (2013.01); H03F 3/602 (2013.01); H03F 3/604 (2013.01); H01L 24/48 (2013.01); H01L 2223/6627 (2013.01); H01L 2223/6644 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49175 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/13064 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/141 (2013.01); H03F 2200/114 (2013.01); H03F 2200/222 (2013.01); H03F 2200/318 (2013.01); H03F 2200/387 (2013.01); H03F 2200/411 (2013.01); H03F 2200/432 (2013.01); H03F 2200/451 (2013.01); H03F 2200/543 (2013.01); H03F 2203/21139 (2013.01);
Abstract

A Doherty amplifier module includes a substrate, an RF signal splitter, a carrier amplifier die, and first and second peaking amplifier dies. The RF signal splitter divides an input RF signal into first, second, and third input RF signals, and conveys the input RF signals to splitter output terminals. The carrier amplifier die includes one or more first power transistors configured to amplify, along a carrier signal path, the first input RF signal to produce an amplified first RF signal. The peaking amplifier dies each include one or more additional power transistors configured to amplify, along first and second peaking signal paths, the second and third input RF signals to produce amplified second and third RF signals. The dies are coupled to the substrate so that the RF signal paths through the carrier and one or more of the peaking amplifier dies extend in substantially different (e.g., orthogonal) directions.


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