The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 31, 2021
Filed:
Jun. 27, 2019
Xilinx, Inc., San Jose, CA (US);
Suresh Ramalingam, Fremont, CA (US);
Kun-Yung Chang, Los Altos Hills, CA (US);
Yohan Frans, Palo Alto, CA (US);
Chuan Xie, Fremont, CA (US);
Mayank Raj, Sunnyvale, CA (US);
XILINX, INC., San Jose, CA (US);
Abstract
An improved chip package, and methods for fabricating the same are provided that utilize two tier packaging of an optical die and another die commonly disposed over a substrate. In one example, a chip package is provided that includes an optical die, a core die, and an electrical/optical interface die are all disposed over a common substrate. In one example, a first routing region is provided between the core and electrical/optical interface dies, a second routing region is provided between the electrical/optical interface die and the optical dies, and a third routing region is disposed between the substrate and the core and electrical/optical interface dies.