The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 31, 2021

Filed:

Apr. 29, 2019
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Chun-Hao Liao, Hsinchu, TW;

Chu-Fu Chen, Hsinchu County, TW;

Jui-Yean Chiu, Hsinchu County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/02 (2006.01); H01L 21/66 (2006.01); H01L 27/092 (2006.01); H01L 21/8238 (2006.01); H01L 21/265 (2006.01);
U.S. Cl.
CPC ...
H01L 22/14 (2013.01); H01L 21/265 (2013.01); H01L 21/823892 (2013.01); H01L 22/34 (2013.01); H01L 27/0928 (2013.01);
Abstract

A method for fabricating a semiconductor device includes at least the following steps. First, a substrate having a first conductivity type is provided and the substrate is doped with a second conductivity type dopant to form a first well region and a second well region in the substrate, wherein the first conductivity type is opposite to the second conductivity type. An inverter is formed in the first well region. A control transistor and a reference transistor are formed in the second well region, wherein the inverter is electrically connected to the control transistor. An electrical connection path is formed between the inverter and a gate of the control transistor. A difference between electrical parameters of the control transistor and the reference transistor in the control wafer is measured to obtain a measuring result. The semiconductor device having a layout design is fabricated based on the measuring result.


Find Patent Forward Citations

Liao, Chun-Hao. (2021). Control wafer and method for fabricating semiconductor device (U.S. Patent No. 11107737). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11107737

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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