The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 31, 2021
Filed:
Sep. 24, 2019
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventor:
Chung-Chieh Lee, Taipei, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/02 (2006.01); C11D 3/22 (2006.01); C11D 1/00 (2006.01); C11D 3/16 (2006.01); C11D 11/00 (2006.01); C11D 3/37 (2006.01); H01L 31/0392 (2006.01); H01L 31/18 (2006.01); H01L 31/20 (2006.01); H01L 21/3105 (2006.01); H01L 21/266 (2006.01); H01L 21/3065 (2006.01); H01L 21/306 (2006.01); H01L 21/311 (2006.01); H01L 21/3213 (2006.01); H01L 21/321 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02057 (2013.01); C11D 1/008 (2013.01); C11D 3/162 (2013.01); C11D 3/222 (2013.01); C11D 3/3757 (2013.01); C11D 11/0047 (2013.01); H01L 21/67051 (2013.01); H01L 31/0392 (2013.01); H01L 31/1836 (2013.01); H01L 31/202 (2013.01); H01L 21/0206 (2013.01); H01L 21/02065 (2013.01); H01L 21/02068 (2013.01); H01L 21/02074 (2013.01); H01L 21/266 (2013.01); H01L 21/3065 (2013.01); H01L 21/30625 (2013.01); H01L 21/31053 (2013.01); H01L 21/31058 (2013.01); H01L 21/31116 (2013.01); H01L 21/31138 (2013.01); H01L 21/3212 (2013.01); H01L 21/32136 (2013.01);
Abstract
In a method of cleaning a substrate, a solution including a size-modification material is applied on a substrate, on which particles to be removed are disposed. Size-modified particles having larger size than the particles are generated, from the particles and the size-modification material. The size-modified particles are removed from the substrate.