The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 31, 2021

Filed:

Aug. 15, 2019
Applicant:

Shinko Electric Industries Co., Ltd., Nagano, JP;

Inventor:

Tatsuaki Denda, Nagano, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61B 5/1455 (2006.01); A61B 5/00 (2006.01); H01Q 1/27 (2006.01); H01Q 1/22 (2006.01); H05K 1/18 (2006.01); A61B 5/021 (2006.01); A61B 5/024 (2006.01);
U.S. Cl.
CPC ...
A61B 5/6826 (2013.01); A61B 5/002 (2013.01); A61B 5/02141 (2013.01); A61B 5/02427 (2013.01); A61B 5/02433 (2013.01); A61B 5/1455 (2013.01); A61B 5/14552 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/273 (2013.01); H05K 1/189 (2013.01); A61B 2560/0214 (2013.01); A61B 2562/0233 (2013.01); A61B 2562/227 (2013.01); H01L 2223/6677 (2013.01); H01L 2924/00 (2013.01); H01L 2924/00014 (2013.01); H05K 2201/055 (2013.01); H05K 2201/056 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10189 (2013.01); Y10T 29/4913 (2015.01);
Abstract

A semiconductor device includes an antenna mounted on a wiring substrate. A holding member includes a first plate-shaped part having a first surface and a second surface, a second plate-shaped part having a third surface and a fourth surface, and a coupling part configured to couple the first plate-shaped part and the second plate-shaped part so that the second surface and the third surface have parts facing each other with a space therebetween. The one end of the wiring substrate is fixed to the holding member so that the antenna overlaps the coupling part, as seen from above. A part continuing to the one end of the wiring substrate is folded back so as to being arranged sequentially along the first surface, the second surface, the third surface, and the fourth surface. The other end of the wiring substrate extends in an elastically deformable state from the fourth surface.


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