The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 24, 2021
Filed:
Nov. 26, 2019
Applicant:
Nxp Usa, Inc., Austin, TX (US);
Inventor:
Jinbang Tang, Chandler, AZ (US);
Assignee:
NXP USA, INC., Austin, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 21/00 (2006.01); H01Q 1/22 (2006.01); H01Q 9/04 (2006.01); H01Q 1/24 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); H01Q 9/0435 (2013.01); H01Q 21/0025 (2013.01); H01Q 21/0087 (2013.01); H01Q 1/2291 (2013.01); H01Q 1/241 (2013.01);
Abstract
A semiconductor device package having at least one integrated circuit (IC) die, at least two antennas oriented in at least two different directions, and a combiner/divider structure connecting the at least two antennas to the at least one IC die and configured to combine/divide signals transmitted between the at least two antennas and the at least one IC die. The package may be fabricated using an additive manufacturing process (i.e., 3D printing). In certain embodiments, the package is an integrated radio package having a multi-directional antenna array.