The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 24, 2021
Filed:
Jul. 11, 2019
Applicant:
Winbond Electronics Corp., Taichung, TW;
Inventors:
Assignee:
WINBOND ELECTRONICS CORP., Taichung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/8234 (2006.01); H01L 27/108 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 21/823462 (2013.01); H01L 21/76814 (2013.01); H01L 21/823468 (2013.01); H01L 27/10844 (2013.01);
Abstract
A semiconductor structure includes a semiconductor substrate, a gate stack disposed over the semiconductor substrate, a first oxide spacer disposed along a sidewall of the gate stack, a protection portion disposed over the first oxide spacer, and an interlayer dielectric layer disposed over the semiconductor substrate. The first oxide spacer and the protection portion are disposed between the gate stack and the interlayer dielectric layer.