The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 24, 2021
Filed:
Apr. 02, 2019
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Naoyuki Takeda, Tokyo, JP;
Kazunari Nakata, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); B24B 7/22 (2006.01); H01L 21/463 (2006.01); H01L 21/304 (2006.01); B24B 37/11 (2012.01); B24B 37/10 (2012.01); B24B 37/34 (2012.01);
U.S. Cl.
CPC ...
H01L 21/67092 (2013.01); B24B 7/228 (2013.01); B24B 37/10 (2013.01); B24B 37/11 (2013.01); B24B 37/34 (2013.01); H01L 21/304 (2013.01); H01L 21/463 (2013.01); H01L 21/67219 (2013.01); H01L 21/67288 (2013.01);
Abstract
A wafer grinding apparatus performs grinding processing for grinding a semiconductor wafer with a grindstone. The grindstone has a wear rate as a characteristic. The wear rate is 5% or more, and less than 200%. A determination part performs determination processing for determining whether a grinding state with respect to the semiconductor wafer is abnormal or normal, based on at least one of a load current of a motor and a grinding wear amount.