The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 24, 2021

Filed:

Mar. 19, 2020
Applicant:

Alpha and Omega Semiconductor International Lp, Sunnyvale, CA (US);

Inventors:

Zhiqiang Niu, Santa Clara, CA (US);

Long-Ching Wang, Cupertino, CA (US);

Yueh-Se Ho, Sunnyvale, CA (US);

Lingpeng Guan, San Jose, CA (US);

Wenjun Li, Portland, OR (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/425 (2006.01); H01L 21/308 (2006.01); H01L 29/66 (2006.01); H01L 21/8222 (2006.01); H01L 21/3213 (2006.01); H01L 21/304 (2006.01); H01L 21/02 (2006.01); H01L 21/306 (2006.01); H01L 21/82 (2006.01); H01L 21/04 (2006.01);
U.S. Cl.
CPC ...
H01L 21/308 (2013.01); H01L 21/02378 (2013.01); H01L 21/046 (2013.01); H01L 21/0475 (2013.01); H01L 21/304 (2013.01); H01L 21/30604 (2013.01); H01L 21/32134 (2013.01); H01L 21/8213 (2013.01); H01L 21/8222 (2013.01); H01L 29/66325 (2013.01);
Abstract

A process is applied to develop a plurality of reverse conducting insulated gate bipolar transistors (RCIGBTs). The process comprises the steps of providing a wafer, applying a first grinding process, patterning a mask, applying an etching process, removing the mask, implanting N++ type dopant, applying a second grinding process forming a TAIKO ring, implanting P+ type dopant, annealing and depositing TiNiAg or TiNiVAg, removing the TAIKO ring, attaching a tape, and applying a singulation process. The mask can be a soft mask or a hard mask. The etching process can be a wet etching only; a wet etching followed by a dry etching; or a dry etching only.


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