The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 24, 2021

Filed:

Sep. 17, 2019
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Anantha K. Subramani, San Jose, CA (US);

Hanbing Wu, Millbrae, CA (US);

Wei W. Wang, Santa Clara, CA (US);

Ashish Goel, Bangalore, IN;

Srinivas Guggilla, San Jose, CA (US);

Lavinia Nistor, Saint Martin le Vinoux, FR;

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/34 (2006.01); C23C 14/34 (2006.01); C23C 14/56 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H01J 37/3417 (2013.01); C23C 14/3464 (2013.01); C23C 14/564 (2013.01); H01J 37/32871 (2013.01); H01J 37/3429 (2013.01); H01J 37/3441 (2013.01); H01J 37/3447 (2013.01); H01J 37/3464 (2013.01); H01J 37/3485 (2013.01);
Abstract

Embodiments of a method and apparatus for co-sputtering multiple target materials are provided herein. In some embodiments, a process chamber including a substrate support to support a substrate; a plurality of cathodes coupled to a carrier and having a corresponding plurality of targets to be sputtered onto the substrate; and a process shield coupled to the carrier and extending between adjacent pairs of the plurality of targets.


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