The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11100270 B1

Date of Patent:

Aug. 24, 2021

Filed:

Jun. 17, 2020

Pattern based die connector assignment using machine learning image recognition

Applicant:

Synopsys, Inc., Mountain View, CA (US);

Inventors:

Xun Liu, Durham, NC (US);

Shamik Saha, Durham, NC (US);

Assignee:

Synopsys, Inc., Mountain View, CA (US);

Attorney:

Fenwick & West LLP

Primary Examiner:

Paul Dinh

Int. Cl.

CPC ...

G06F 30/392 (2020.01); G06K 9/68 (2006.01); G06N 3/08 (2006.01); G06F 30/27 (2020.01);

U.S. Cl.

CPC ...

G06F 30/392 (2020.01); G06F 30/27 (2020.01); G06K 9/6807 (2013.01); G06N 3/08 (2013.01);

Abstract

A method for assigning connections between IO pad pins and connectors on an integrated circuit (IC) die. A pattern () including a physical layout of connectors () and pad pins () is associated with a mapping of connections between the connectors () and the pad pins (). A processor () identifies instances () of the pattern () within a design image () of an integrated circuit (IC) die using a machine learning model. The design image () includes a physical layout of connectors () and pad pins (). For each identified instance () of the pattern () within the design image (), the mapping of connections is assigned to respective connectors () and pad pins () in the identified instance ().

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