The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 17, 2021
Filed:
Aug. 09, 2019
Applicant:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Inventors:
Hao-Chih Hsieh, Kaohsiung, TW;
Tun-Ching Pi, Kaohsiung, TW;
Sung-Hung Chiang, Kaohsiung, TW;
Yu-Chang Chen, Kaohsiung, TW;
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/13 (2006.01); H01L 23/14 (2006.01); H01L 23/498 (2006.01); H01L 23/40 (2006.01);
U.S. Cl.
CPC ...
H01L 23/13 (2013.01); H01L 23/147 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 2023/4087 (2013.01);
Abstract
A semiconductor device package includes a carrier, a first interposer disposed and a second interposer. The second interposer is stacked on the first interposer, and the first interposer is mounted to the carrier. The combination of the first interposer and the second interposer is substantially T-shaped.
Hsieh, Hao-Chih. (2021). Semiconductor device package (U.S. Patent No. 11094602). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11094602
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile