The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 17, 2021
Filed:
Jun. 03, 2015
Intel Corporation, Santa Clara, CA (US);
Christopher J. Jezewski, Hillsboro, OR (US);
Srijit Mukherjee, Hillsboro, OR (US);
Daniel B. Bergstrom, Lake Oswego, OR (US);
Tejaswi K. Indukuri, Portland, OR (US);
Flavio Griggio, Portland, OR (US);
Ramanan V. Chebiam, Hillsboro, OR (US);
James S. Clarke, Portland, OR (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
In one embodiment, a conductive connector for a microelectronic component may be formed with a noble metal layer, acting as an adhesion/wetting layer, disposed between a barrier liner and a conductive fill material. In a further embodiment, the conductive connector may have a noble metal conductive fill material disposed directly on the barrier liner. The use of a noble metal as an adhesion/wetting layer or as a conductive fill material may improve gapfill and adhesion, which may result in the conductive connector being substantially free of voids, thereby improving the electrical performance of the conductive connector relative to conductive connectors without a noble metal as the adhesion/wetting layer or the conductive fill material.