Conduction inspection device member and conduction inspection device

Abstract

Provided is a conduction inspection device member, wherein cracks and voids are less likely to form in conductive parts, conduction performance is less likely to be impaired even when a conduction test is repeated, and contact marks are less likely to remain in the portion of the member in contact with a member to be tested. Also provided is a conduction inspection device comprising the conduction inspection device member. The conduction inspection device member comprises a substrate, through holes, and conductive parts. The multiple through holesare arranged in the substrate, the conductive partsare housed inside the through holes, and the conductive partscontain conductive particles. The conductive particleseach comprise a substrate particleand a conductive layeron the surface of the substrate particle. The conductive layerhas multiple protrusionson the outer surface thereof.