The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 10, 2021
Filed:
May. 14, 2020
Applicant:
Ibiden Co., Ltd., Ogaki, JP;
Inventor:
Masashi Awazu, Ogaki, JP;
Assignee:
IBIDEN CO., LTD., Ogaki, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 3/06 (2006.01); H05K 3/40 (2006.01); H05K 3/46 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4688 (2013.01); H05K 1/11 (2013.01); H05K 1/111 (2013.01); H05K 3/06 (2013.01); H05K 3/4632 (2013.01); H05K 1/0284 (2013.01); H05K 1/0298 (2013.01); H05K 1/112 (2013.01); H05K 1/18 (2013.01);
Abstract
A printed wiring board includes a resin insulating layer, a conductor layer formed on a surface of the resin insulating layer, an outermost insulating layer formed on the resin insulating layer such that the outermost insulating layer is covering the conductor layer and has an opening extending to the conductor layer, and a metal post formed in the opening of the outermost insulating layer such that the metal post is protruding from the outermost insulating layer.