The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 10, 2021
Filed:
Aug. 29, 2018
Applicant:
Stats Chippac Pte. Ltd., Singapore, SG;
Inventors:
Changoh Kim, Incheon, KR;
Kyounghee Park, Seoul, KR;
Kyowang Koo, Incheon, KR;
Sungwon Cho, Seoul, KR;
Assignee:
STATS ChipPAC Pte. Ltd., Singapore, SG;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/31 (2006.01); H01L 23/04 (2006.01); H01L 25/065 (2006.01); H01L 21/78 (2006.01); H01L 25/00 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/56 (2013.01); H01L 21/78 (2013.01); H01L 23/04 (2013.01); H01L 23/3121 (2013.01); H01L 25/0655 (2013.01); H01L 25/50 (2013.01);
Abstract
A semiconductor device has a substrate. A lid is disposed over the substrate. An encapsulant is deposited over the substrate. A film mask is disposed over the encapsulant with the lid exposed from the film mask and encapsulant. A conductive layer is formed over the film mask, encapsulant, and lid. The film mask is removed after forming the conductive layer.