The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 10, 2021
Filed:
Nov. 01, 2019
Applicant:
Globalfoundries U.s. Inc., Santa Clara, CA (US);
Inventors:
Souvick Mitra, Essex Junction, VT (US);
Rainer Thoma, Essex Junction, VT (US);
Harsh Shah, South Burlington, VT (US);
Anindya Nath, Essex Junction, VT (US);
Robert J. Gauthier, Jr., Williston, VT (US);
Assignee:
GLOBALFOUNDRIES U.S. INC., Santa Clara, CA (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 21/74 (2006.01); H01L 29/417 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5283 (2013.01); H01L 21/743 (2013.01); H01L 23/5221 (2013.01); H01L 29/41791 (2013.01);
Abstract
Back-end-of-line layout structures and methods of forming a back-end-of-line layout structure. A metallization level includes a plurality of interconnects positioned over a plurality of active device regions. The plurality of interconnects have a triangular-shaped layout and a plurality of lengths within the triangular-shaped layout.