The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 10, 2021

Filed:

Apr. 01, 2019
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Seung-Min Shin, Daejeon, KR;

Seok-Hoon Kim, Seongnam-si, KR;

Young-Hoo Kim, Yongin-si, KR;

In-Gi Kim, Hwaseong-si, KR;

Tae-Hong Kim, Seoul, KR;

Sung-Hyun Park, Daegu, KR;

Jin-Woo Lee, Yongin-si, KR;

Ji-Hoon Cha, Seoul, KR;

Yong-Jun Choi, Gwacheon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/02 (2006.01); H01J 37/32 (2006.01); G02B 27/09 (2006.01); B23K 26/352 (2014.01); B08B 7/00 (2006.01); H01L 29/66 (2006.01); H01L 27/11556 (2017.01); H01L 27/11582 (2017.01);
U.S. Cl.
CPC ...
H01L 21/67034 (2013.01); B08B 7/0042 (2013.01); B23K 26/352 (2015.10); G02B 27/0955 (2013.01); H01J 37/3244 (2013.01); H01J 37/32568 (2013.01); H01L 21/02098 (2013.01); H01J 2237/335 (2013.01); H01L 27/11556 (2013.01); H01L 27/11582 (2013.01); H01L 29/66545 (2013.01); H01L 29/66795 (2013.01);
Abstract

A dry cleaning apparatus includes a chamber, a substrate support supporting a substrate within the chamber, a shower head arranged in an upper portion of the chamber to supply a dry cleaning gas toward the substrate, the shower head including an optical window transmitting a laser light therethrough toward the substrate support, a plasma generator generating plasma from the dry cleaning gas, and a laser irradiator irradiating the laser light on the substrate through the optical window and the plasma to heat the substrate.


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