The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 10, 2021

Filed:

Jul. 19, 2019
Applicant:

Asml Netherlands B.v., Veldhoven, NL;

Inventors:

Wei Fang, Milpitas, CA (US);

Joe Wang, Campbell, CA (US);

Assignee:

ASML Netherlands B.V., Veldhoven, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/22 (2006.01); G01N 21/95 (2006.01); G01N 21/956 (2006.01); H01J 37/14 (2006.01); H01J 37/147 (2006.01); H01J 37/244 (2006.01); H01J 37/28 (2006.01); H01J 37/153 (2006.01);
U.S. Cl.
CPC ...
H01J 37/222 (2013.01); G01N 21/9501 (2013.01); G01N 21/9505 (2013.01); G01N 21/956 (2013.01); H01J 37/14 (2013.01); H01J 37/1471 (2013.01); H01J 37/153 (2013.01); H01J 37/22 (2013.01); H01J 37/226 (2013.01); H01J 37/244 (2013.01); H01J 37/28 (2013.01); H01J 2237/153 (2013.01); H01J 2237/20292 (2013.01); H01J 2237/24592 (2013.01); H01J 2237/2804 (2013.01); H01J 2237/31798 (2013.01);
Abstract

A wafer inspection system includes a controller in communication with an electron-beam inspection tool. The controller includes circuitry to: acquire, via an optical imaging tool, coordinates of defects on a sample; set a Field of View (FoV) of the electron-beam inspection tool to a first size to locate a subset of the defects; determine a position of each defect of the subset of the defects based on inspection data generated by the electron-beam inspection tool during a scanning of the sample; adjust the coordinates of the defects based on the determined positions of the subset of the defects; and set the FoV of the electron-beam inspection tool to a second size to locate additional defects based on the adjusted coordinates.


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