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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11086219 B1

PDFFull Text
Date of Patent:
Aug. 10, 2021

Filed:

Mar. 15, 2017

Negative-type photosensitive resin composition, cured film, display device that includes the cured film, and production method therefor

Applicant:

Toray Industries, Inc., Tokyo, JP;

Inventors:

Yugo Tanigaki, Otsu, JP;

Daisuke Sakii, Otsu, JP;

Satoshi Kamemoto, Otsu, JP;

Assignee:

TORAY INDUSTRIES, INC., Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

John A McPherson

Int. Cl.
CPC ...
G03F 7/027 (2006.01); G03F 7/032 (2006.01); G03F 7/037 (2006.01); H01L 51/50 (2006.01); G03F 7/075 (2006.01); G03F 7/105 (2006.01); G03F 7/00 (2006.01); H01L 27/32 (2006.01); G03F 7/004 (2006.01); H05B 33/22 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
G03F 7/037 (2013.01); G03F 7/0007 (2013.01); G03F 7/0046 (2013.01); G03F 7/0047 (2013.01); G03F 7/027 (2013.01); G03F 7/032 (2013.01); G03F 7/0757 (2013.01); G03F 7/105 (2013.01); H01L 27/3262 (2013.01); H01L 51/50 (2013.01); H05B 33/22 (2013.01); H05K 3/287 (2013.01);
Abstract

To provide a negative-type photosensitive resin composition that is highly sensitive and capable of formation of a low-taper pattern shape and that is capable of providing a cured film that is excellent in heat resistance. A negative-type photosensitive resin composition contains an (A) alkali-soluble resin, a (B) radical polymerizable compound, and a (C) photo initiator, the negative-type photosensitive resin composition being characterized in that the (A) alkali-soluble resin contains one or more species of resins selected from a (A-1) polyimide, a (A-2) polybenzoxazole, a (A-3) polyimide precursor, a (A-4) polybenzoxazole precursor, a (A-5) polysiloxane, and a (A-6) cardo based resin, and that the (B) radical polymerizable compound contains a compound having five ethylenic unsaturated bond groups in a (B-1) molecule, in an amount within the range of 51 to 99 mass %.

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