The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 10, 2021

Filed:

Apr. 07, 2017
Applicant:

Sekisui Polymatech Co., Ltd., Saitama, JP;

Inventors:

Hiroki Kudoh, Saitama, JP;

Tomonari Yamada, Saitama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09K 5/14 (2006.01); C08J 5/18 (2006.01); C08K 3/22 (2006.01); C08K 7/06 (2006.01); C08L 101/00 (2006.01); B29C 35/02 (2006.01); B29C 39/00 (2006.01); B29C 39/38 (2006.01); B29C 69/00 (2006.01); C08G 77/06 (2006.01); C08K 3/04 (2006.01); B29K 83/00 (2006.01); B29K 507/04 (2006.01); B29L 7/00 (2006.01);
U.S. Cl.
CPC ...
C09K 5/14 (2013.01); B29C 35/02 (2013.01); B29C 39/003 (2013.01); B29C 39/38 (2013.01); B29C 69/001 (2013.01); C08G 77/06 (2013.01); C08J 5/18 (2013.01); C08K 3/04 (2013.01); C08K 3/22 (2013.01); C08K 7/06 (2013.01); C08L 101/00 (2013.01); B29K 2083/00 (2013.01); B29K 2507/04 (2013.01); B29K 2995/0013 (2013.01); B29L 2007/002 (2013.01); C08J 2383/04 (2013.01); C08K 2003/2227 (2013.01); C08K 2201/001 (2013.01);
Abstract

To provide a thermally conductive sheet that has high thermal conductivity. A method for producing a thermally conductive sheet S includes a step of obtaining a thermally conductive composition by mixing a reactive liquid resin, which forms a rubbery or gelatinous matrix when crosslinked, a volatile liquid having a boiling point 10° C. or more higher than a curing temperature of the reactive liquid resin, and a thermally conductive filler; a step of forming a molded body by crosslinking and curing the reactive liquid resin at a temperature 10° C. or more lower than the boiling point of the volatile liquid; and a step of evaporating the volatile liquid by heating the molded body, in which these steps are performed sequentially.


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