The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 10, 2021
Filed:
May. 22, 2019
International Business Machines Corporation, Armonk, NY (US);
Chi-Chun Liu, Altamont, NY (US);
Yann Mignot, Slingerlands, NY (US);
Joshua T. Smith, Croton on Hudson, NY (US);
Bassem M. Hamieh, Albany, NY (US);
Nelson Felix, Slingerlands, NY (US);
Robert L. Bruce, White Plains, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A microfluidic chip with a high volumetric flow rate is provided that includes at least two vertically stacked microfluidic channel layers, each microfluidic channel layer including an array of spaced apart pillars. Each microfluidic channel layer is interconnected by an inlet/outlet opening that extends through the microfluidic chip. The microfluidic chip is created without wafer to wafer bonding thus circumventing the cost and yield issues associated with microfluidic chips that are created by wafer bonding.