The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 03, 2021

Filed:

Jun. 08, 2020
Applicants:

Fu Ding Precision Industrial (Zhengzhou) Co., Ltd., Zhengzhou, CN;

Foxconn Interconnect Technology Limited, Grand Cayman, KY;

Inventors:

Shih-Wei Hsiao, New Taipei, TW;

Yu-San Hsiao, New Taipei, TW;

Yen-Chih Chang, New Taipei, TW;

Wei-Chou Lin, New Taipei, TW;

Yu-Ke Chen, Kunshan, CN;

Meng Liu, Kunshan, CN;

Na Yang, Kunshan, CN;

Xiao-Li Liu, Kunshan, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/648 (2006.01); H01R 13/6471 (2011.01); H01R 13/6587 (2011.01); H01R 12/72 (2011.01); H01R 13/502 (2006.01); H01R 12/73 (2011.01);
U.S. Cl.
CPC ...
H01R 13/6471 (2013.01); H01R 12/727 (2013.01); H01R 12/732 (2013.01); H01R 13/502 (2013.01); H01R 13/6587 (2013.01);
Abstract

An electrical connector includes an insulative housing defining a space. A connection module is received within the space. The connection module includes a pair of contact modules commonly sandwiching a grounding module therebetween in the transverse direction. Each contact module includes a plurality of contacts integrally formed within the corresponding insulative wafer via insert-molding. The grounding module includes a grounding plate embedded within an insulative wafer. The grounding plate forms a plurality of fingers respectively electrically and mechanically connecting to the corresponding grounding contacts of the contact modules. The wafer forms a plurality of transverse grooves to receive corresponding grounding bars each having a plurality of inward parts respectively mechanically and electrically connecting to the grounding plate, and a plurality of outward parts respectively mechanically and electrically connecting to the grounding contacts of the contact modules.


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