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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11081413 B1

PDFFull Text
Date of Patent:
Aug. 03, 2021

Filed:

Feb. 21, 2019

Semiconductor package with inner and outer cavities

Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventors:

Hsin Lin Wu, Kaohsiung, TW;

Yu-Hsuan Tsai, Kaohsiung, TW;

Chang Chin Tsai, Kaohsiung, TW;

Lu-Ming Lai, Kaohsiung, TW;

Ching-Han Huang, Kaohsiung, TW;

Assignee:

ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;

Attorney:

Foley & Lardner LLP

Primary Examiner:

Peter Bradford

Int. Cl.
CPC ...
H01L 23/20 (2006.01); H01L 23/043 (2006.01); H01L 21/48 (2006.01); H01L 23/10 (2006.01); H01L 23/26 (2006.01); H01L 23/053 (2006.01);
U.S. Cl.
CPC ...
H01L 23/20 (2013.01); H01L 21/4803 (2013.01); H01L 23/043 (2013.01); H01L 23/053 (2013.01); H01L 23/10 (2013.01); H01L 23/26 (2013.01); B81B 2203/0315 (2013.01);
Abstract

A semiconductor package structure includes a substrate, a semiconductor die, a lid and a cap. The semiconductor die is disposed on the substrate. The lid is disposed on the substrate. The cap is disposed on the lid. The substrate, the lid and the cap define a cavity in which the semiconductor die is disposed, and a pressure in the cavity is greater than an atmospheric pressure outside the cavity.

Find Patent Forward Citations

Wu, Hsin. (2021). Semiconductor package with inner and outer cavities (U.S. Patent No. 11081413). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11081413

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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