The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 03, 2021
Filed:
Feb. 21, 2019
Applicant:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Inventors:
Hsin Lin Wu, Kaohsiung, TW;
Yu-Hsuan Tsai, Kaohsiung, TW;
Chang Chin Tsai, Kaohsiung, TW;
Lu-Ming Lai, Kaohsiung, TW;
Ching-Han Huang, Kaohsiung, TW;
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/20 (2006.01); H01L 23/043 (2006.01); H01L 21/48 (2006.01); H01L 23/10 (2006.01); H01L 23/26 (2006.01); H01L 23/053 (2006.01);
U.S. Cl.
CPC ...
H01L 23/20 (2013.01); H01L 21/4803 (2013.01); H01L 23/043 (2013.01); H01L 23/053 (2013.01); H01L 23/10 (2013.01); H01L 23/26 (2013.01); B81B 2203/0315 (2013.01);
Abstract
A semiconductor package structure includes a substrate, a semiconductor die, a lid and a cap. The semiconductor die is disposed on the substrate. The lid is disposed on the substrate. The cap is disposed on the lid. The substrate, the lid and the cap define a cavity in which the semiconductor die is disposed, and a pressure in the cavity is greater than an atmospheric pressure outside the cavity.