The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 03, 2021

Filed:

Jan. 10, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Kisik Choi, Watervliet, NY (US);

Koichi Motoyama, Clifton Park, NY (US);

Ashim Dutta, Menands, NY (US);

Iqbal R. Saraf, Cobleskill, NY (US);

Benjamin D. Briggs, Waterford, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/535 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76834 (2013.01); H01L 21/0228 (2013.01); H01L 21/02183 (2013.01); H01L 21/76877 (2013.01); H01L 21/76883 (2013.01); H01L 21/76897 (2013.01); H01L 23/535 (2013.01);
Abstract

Techniques for forming barrierless contacts filled with Co are provided. In one aspect, a method for forming barrierless contacts includes: forming bottom metal contacts in a first ILD; depositing a second ILD on the bottom metal contacts; forming contact vias in the second ILD landing on the bottom metal contacts; selectively forming a liner on a top surface of the second ILD and on the second ILD along sidewalls of the contact vias; filling the contact vias with a metal; and removing an excess of the metal to form the barrierless contacts whereby metal-to-metal contact is present between the barrierless contacts and the bottom metal contacts. A contact structure is also provided.


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