The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 03, 2021
Filed:
Aug. 22, 2019
Applicant:
Globalwafers Co., Ltd., Hsinchu, TW;
Inventors:
Ichiro Yoshimura, Shimotsuke, JP;
Alex Chu, HsinChu, TW;
H. J. Chiu, Taoyuan, TW;
Sumeet Bhagavat, St. Charles, MO (US);
TaeHyeong Kim, Cheonan, KR;
Norimasa Katakura, Sakado, JP;
Masaru Kitazawa, Tochigi, JP;
Assignee:
GlobalWafers Co., Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/304 (2006.01); B24B 37/005 (2012.01); H01L 21/463 (2006.01); B24B 49/03 (2006.01); H01L 21/02 (2006.01); G01N 21/95 (2006.01); H01L 21/306 (2006.01);
U.S. Cl.
CPC ...
H01L 21/304 (2013.01); B24B 37/005 (2013.01); B24B 49/03 (2013.01); G01N 21/9503 (2013.01); H01L 21/02021 (2013.01); H01L 21/02024 (2013.01); H01L 21/463 (2013.01); H01L 21/30625 (2013.01);
Abstract
Methods for polishing semiconductor substrates that involve adjusting the finish polishing sequence based on the pad-to-pad variance of the polishing pad are disclosed.