The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 03, 2021
Filed:
Dec. 29, 2017
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Liuyang Yang, Portland, OR (US);
Manoj Sastry, Portland, OR (US);
Yonghong Huang, Portland, OR (US);
Xiruo Liu, Portland, OR (US);
Noor Abani, Santa Clara, CA (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01S 19/21 (2010.01); H04W 4/02 (2018.01); G01C 21/30 (2006.01); H04W 4/44 (2018.01); H04W 4/46 (2018.01); G08G 1/01 (2006.01); G08G 1/0967 (2006.01); H04L 29/06 (2006.01); H04W 12/122 (2021.01); H04W 4/20 (2018.01); H04W 12/63 (2021.01); H04W 12/104 (2021.01);
U.S. Cl.
CPC ...
G01C 21/30 (2013.01); G01S 19/215 (2013.01); G08G 1/0112 (2013.01); G08G 1/0116 (2013.01); G08G 1/0129 (2013.01); G08G 1/096775 (2013.01); G08G 1/096783 (2013.01); H04L 63/1466 (2013.01); H04W 4/025 (2013.01); H04W 4/44 (2018.02); H04W 4/46 (2018.02); H04W 12/122 (2021.01); H04W 4/20 (2013.01); H04W 12/104 (2021.01); H04W 12/63 (2021.01);
Abstract
An embodiment of a semiconductor package apparatus may include technology to acquire location related information, acquire local area characteristic information, and verify the location related information based on the local area characteristic information. Other embodiments are disclosed and claimed.