The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 27, 2021

Filed:

Jul. 31, 2020
Applicants:

Fuji Electric Co., Ltd., Kawasaki, JP;

Waseda University, Tokyo, JP;

Inventors:

Ryoichi Kato, Kanagawa, JP;

Hiromichi Gohara, Kanagawa, JP;

Yoshinari Ikeda, Kanagawa, JP;

Tomoyuki Miyashita, Tokyo, JP;

Yoshihiro Tateishi, Tokyo, JP;

Shunsuke Numata, Tokyo, JP;

Assignees:

FUJI ELECTRIC CO., LTD., Kawasaki, JP;

WASEDA UNIVERSITY, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/473 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/473 (2013.01); H01L 23/49822 (2013.01);
Abstract

Provided is a cooler having high cooling efficiency and low pressure loss of fluid. A cooler includes: a flow-channel part at least including a plate-like fin (top plate) and a plate-like fin (bottom plate); and a continuous groove-like flow channel defined between the top plate and the bottom plate to flow fluid, the cooler being configured to cool semiconductor elements. When the flow-channel part is viewed from the direction parallel to the top plate and intersecting the flow channel, the flow channel has a corrugated shape so that a face of the flow channel closer to the top plate and a face of the flow channel closer to the bottom plate bend in a synchronized manner toward the top plate and the bottom plate.


Find Patent Forward Citations

Loading…