The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 27, 2021
Filed:
Nov. 04, 2016
Sumco Corporation, Tokyo, JP;
Takashi Nishitani, Tokyo, JP;
Ryuichi Tanimoto, Tokyo, JP;
SUMCO CORPORATION, Tokyo, JP;
Abstract
A wafer polishing method of applying mirror polishing to a surface of a wafer using a wafer polishing apparatus provided with a multi-zone pressurizing polishing head having a wafer pressing surface divided into a plurality of pressure zones and capable of performing pressurizing control independently for each pressure zone is provided with a measurement step of measuring a nanotopography map on the wafer surface; and a polishing step of performing the polishing by setting the polishing pressure of the polishing head against the wafer for each pressure zone based on a result of the measurement of the nanotopography map.