The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 20, 2021

Filed:

Aug. 24, 2018
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Roland Rupp, Lauf, DE;

Ronny Kern, Finkenstein, AT;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 31/0312 (2006.01); H01L 29/16 (2006.01); H01L 21/78 (2006.01); H01L 29/66 (2006.01); H01L 21/02 (2006.01); H01L 21/04 (2006.01); H01L 21/268 (2006.01); H01L 21/304 (2006.01); H01L 29/06 (2006.01); H01L 21/265 (2006.01); H01L 29/739 (2006.01); H01L 29/78 (2006.01); H01L 29/872 (2006.01);
U.S. Cl.
CPC ...
H01L 29/1608 (2013.01); H01L 21/02378 (2013.01); H01L 21/02529 (2013.01); H01L 21/02694 (2013.01); H01L 21/046 (2013.01); H01L 21/268 (2013.01); H01L 21/304 (2013.01); H01L 21/7813 (2013.01); H01L 29/0615 (2013.01); H01L 29/6606 (2013.01); H01L 29/66068 (2013.01); H01L 21/26506 (2013.01); H01L 29/7395 (2013.01); H01L 29/7827 (2013.01); H01L 29/872 (2013.01);
Abstract

A method for producing a silicon carbide component includes forming a silicon carbide layer on an initial wafer, forming a doping region of the silicon carbide component to be produced in the silicon carbide layer, and forming an electrically conductive contact structure of the silicon carbide component to be produced on a surface of the silicon carbide layer. The electrically conductive contact structure electrically contacts the doping region. Furthermore, the method includes splitting the silicon carbide layer or the initial wafer after forming the electrically conductive contact structure, such that a silicon carbide substrate at least of the silicon carbide component to be produced is split off.


Find Patent Forward Citations

Loading…