The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 20, 2021
Filed:
Mar. 05, 2020
Shinkawa Ltd., Tokyo, JP;
Tomonori Nakamura, Tokyo, JP;
SHINKAWA LTD., Tokyo, JP;
Abstract
The apparatus which assists in deriving bonding conditions includes a bonding unit which bonds a semiconductor chip and a substrate by applying heat and pressure with NCF interposed therebetween, a library in which a variety of physical property information including viscosity characteristic information is collected with respect to each of a plurality of types of NCFs, an initial evaluation condition determination unit which acquires the physical property information corresponding to the NCF used for bonding with reference to the library and determines an initial value of an evaluation condition of bonding evaluation performed by bonding the semiconductor chip and the substrate, and a bonding evaluation unit which drives the bonding unit in accordance with set evaluation condition, bonds the semiconductor chip and the substrate and performs the bonding evaluation at least once to measure the viscosity of the NCF at the time of the bonding.